Semiconductor Engineering - Deep Insights For Chip Engineers
WEBSeptember 16th, 2024 By Karen Heyman. Semiconductor Engineering was created by chip architects, engineers, journalists, end users, industry organizations & standards bodies to provide deep insights into the increasingly complex task of designing, testing, verifying, integrating and manufacturing semiconductors.
Semiconductor Engineering - knowledge-center
WEBA design or verification unit that is pre-packed and available for licensing. Separate electronic devices using Internet or other connections to communicate among the devices. Usually sensors or actuators are sending data to a computing hub. Semiconductor materials enable electronic circuits to be constructed.
Partitioning In The Chiplet Era - Semiconductor Engineering
WEB4 days ago — At the heart of any design involving chiplets are partitioning and prioritization. “This is because what is best implemented in 7nm, for example, an I/O, a SerDes, or PCIe PHY is really optimal technology node for that particular function,” Giuliano said. “This can also be referred to as domain-specific disaggregation.
New Transistor Structures At 3nm/2nm - Semiconductor …
WEBJan 25, 2021 — Intel, Samsung, TSMC and others are laying the groundwork for the transition from today’s finFET transistors to new gate-all-around field-effect transistors (GAA FETs) at the 3nm and 2nm nodes, starting either next year or in 2023. GAA FETs hold the promise of better performance, lower power, and lower leakage, and they will be …
Chip Industry Week In Review - Semiconductor Engineering
WEB3 days ago — October 4th, 2024 - By: The SE Staff. Amkor will provide turnkey advanced packaging and test services to TSMC in Amkor’s planned facility in Peoria, Arizona, in a deal announced on Thursday. The companies jointly specified the packaging technologies, such as TSMC’s Integrated Fan-Out (InFO) and Chip on Wafer on Substrate (CoWoS).
Chip Industry Week In Review - Semiconductor Engineering
WEBSep 27, 2024 — Chip Industry Week In Review. Google’s AlphaChip; 300mm fab equip spending; TSMC-EDA partnerships; $123M CHIPS Act; CXL memory standards; MIPI’s A-PHY v2.0; 12-stack HBM3E; LLMs for chip design and manufacturing; CHIPS Metrology access. Global spending on 300mm fab equipment is expected to reach a record US$400 billion from 2025 to 2027 ...
Gold Substrate Plays Boosts Performance of Tellurium-Based …
WEB1 day ago — A new technical paper titled “Non-Volatile Resistive Switching in Nanoscaled Elemental Tellurium by Vapor Transport Deposition on Gold” was published by researchers at Politecnico di Milano, UT Austin, and STMicroelectronics. Abstract: “Two-dimensional (2D) materials are promising for resistive switching in neuromorphic and in-memory computing, as their atomic thickness substantially ...
Power Semis Usher In The Silicon Carbide Era - Semiconductor …
WEBAug 21, 2023 — Many thousands of power semiconductor modules already are in use in electric vehicles for on-board charging, traction inversion, and DC-to-DC conversion. Today, most of those are fabricated using silicon-based IGBTs. A shift to silicon carbide-based MOSFETs doubles the power density and accelerates switching speed in a smaller and lighter package.
Chip Industry Week In Review - Semiconductor Engineering
WEBApr 5, 2024 — Markets and money. Q4 2023 global foundry revenues grew about 10% QoQ, but fell 3.5% YoY, according to Counterpoint. TSMC remains the dominant supplier with 61% of the market, followed by Samsung and UMC with 16% and 6% respectively.. Worldwide wafer fab equipment sales remained steady YoY, according to Yole. Revenues for 2023 were mostly driven by record shipments to China despite U.S. sanctions.
How To Build Resilience Into Chips - Semiconductor Engineering
WEBFeb 27, 2023 — Fig. 3: Wafer-scale chip builds in about 1.5% redundancy. Source: Cerebras. Feldman said other key pieces are to burn in before mapping out, and exposing chips to temperatures that are outside of the specification. “And from there, self-test checks the behavior of every core and every wire between every core,” he said.